ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,791, issued on July 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Sensor package with cavity created using sacrificial material" wa... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,792, issued on July 28, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and met... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,793, issued on July 28, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor device package with open sensor cavity" was invente... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,794, issued on July 28, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit structure and ma... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,795, issued on July 28, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device, power converter, and moving vehicle" was ... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,796, issued on July 28, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.) and ATI Technologies ULC (Markham, Canada). "Chip... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,797, issued on July 28, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and method of manufac... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,798, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Active device layer at interconnect interfaces" was invented by... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,799, issued on July 28, was assigned to BONDTECH Co. LTD. (Kyoto, Japan). "Bonding method, bonded article, and bonding device" was invented... Read More
ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,800, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including solder and non-solder inte... Read More